一种BGA封装的低损耗毫米波前端模组设计

Design of a Low-Loss Millimeter-Wave Front-End Module with Ball Grid Array Packaging

摘要:

针对小型化、低成本化、集成化T/R组件的需求,提出了一种工作在30~40 GHz的毫米波前端模组。 该模组采用高温共烧陶瓷(HTCC)基板和球栅阵列(BGA)封装,实现了4个收发通道的高密度集成,具备信号放大、功率分配和幅相控制等功能。通过对该模组毫米波信号垂直互连结构的仿真优化,实现了该结构在毫米波频段的低损耗信号传输。设计制作PCB测试板对该垂直互连结构进行测试验证,经计算得到该垂直互连结构最高插入损耗为0.78 dB。采用该毫米波信号垂直互连结构制作了一款Ka波段四通道毫米波前端模组。测试结果表明, 该模组在30~40 GHz时单通道发射功率大于20 dBm,接收增益大于21.33 dB,驻波比优于1.51,满足射频系统的应用需求。

Abstract:

In response to miniaturization, low-cost, and integrated transmit/receive (T/R) module demands, a millimeter-wave frontend module operating in the frequency range of 30-40 GHz was studied. A high-temperature co-fired ceramic (HTCC) substrate and ball grid array (BGA) packaging were adopted to achieve high-density inte gration of four transceiver channels for functions such as signal amplification, power distribution, and amplitude phase control. Through the simulation and optimization of the vertical interconnection structure of the millimeter wave signal in this module, low-loss signal transmission of this structure in the millimeter-wave frequency band was realized. Moreover, a printed circuit board (PCB) was designed and fabricated to test and verify this vertical inter connection structure. After calculations, the maximum insertion loss of the vertical interconnection structure was 0.78 dB. Using this vertical interconnection structure for millimeter-wave signals, a Ka-band four-channel millime ter-wave frontend module was fabricated. The test results show that in the frequency range of 30-40 GHz, the sin gle-channel transmission power of this module was greater than 20 dBm; the receiving gain was greater than 21.33 dB; and the voltage standing wave ratio was better than 1.51, fulfilling the application requirements of the radio-frequency system.