基于陶封微波收发组件的高效清洗工艺方法研究

Efficient Cleaning Process for Ceramic Encapsulated Microwave Transceiver Component

摘要:

陶封微波收发组件内部裸芯片较多，为高效清理其调试后的内部异物残留，提升该类产品生产质量及效率，介绍了一种通过等离子清洗活化芯片表面后再进行二流体清洗的组合式清洗工艺。经理论分析及实验测试，结果表明，相较于传统的人工清理方法，该工艺可高效去除产品内部的异物而不产生负面影响，清洗效率提升了 22 倍，清洗后的产品满足微电子器件实验方法与程序（GJB548C-2021）的各项工艺要求，为复杂内腔环境的微波收发组件提供了一种有效的残留异物清理方案。

Abstract:

The microwave transceiver module contains many bare chips. To efficiently remove internal foreign residues after debugging and to improve the production quality and efficiency of such products， a combined cleaning process has been introduced. This process involves plasma cleaning to activate the chip surfaces， followed by a twofluid cleaning technique. Theoretical analysis and experimental test results show that， compared to traditional manual cleaning methods， this process effectively removes internal foreign materials without causing adverse effects and improves cleaning efficiency by a factor of 22. The cleaned products meet the process requirements specified in the Microelectronics Device Experimental Methods and Procedures （GJB548C-2021）. Based on the process method presented in this study， an effective cleaning solution is provided for removing residual foreign matter in microwave transceiver components with complex internal cavity structures.